| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a printed circuit board having a side pattern which can securely connect the wiring patterns of front and rear surfaces mutually, even if the thickness of an insulating substrate is thick or the routing density of wiring patterns is dense. SOLUTION: Wiring patterns are exposed with an exposure mask to the photosensitive resin films of back and front surfaces of an insulating substrate by using parallel light, and subsequently a side pattern is exposed with a different exposure mask to the photosensitive resin film of the side surface of the above insulating substrate by using parallel light. Thus, the wiring patterns of front and rear surfaces are mutually connected by using the side pattern. COPYRIGHT: (C)2007,JPO&INPIT
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