| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method and a manufacturing apparatus of a semiconductor device capable of suppressing oxidization by controlling the dissolution of a metal film when carrying out medical fluid cleaning of the surface of the semiconductor substrate where the metal film to be prepared as metallic wiring is exposed. SOLUTION: The amount of the dissolution of the metal film is controlled such that the metal dissolution capability of a medical cleaning liquid 1 is changed sequentially into a metal dissolution region and a metal non-dissolving region, by adding metal dissolving capability adjustment liquid, for example pH adjusting liquid 5 or ORP adjustment liquid 6, to the medical cleaning liquid 1 which is supplied to the semiconductor substrate 3 where the metal film is exposed. COPYRIGHT: (C)2007,JPO&INPIT
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