| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor element connection bump with a high reliability which reduces a stress between a semiconductor element and a wiring board, caused by a difference in rates of thermal expansion with a simple structure, and also can electrically connect the both with each other well; and to provide a semiconductor device equipped with the semiocnductor element connection bump. SOLUTION: In a semiconductor element connection bump 20, a semiconductor element 1 is mounted to a circuit board 2 for electrical connection. The bump 20 has a core 25 in which conductive metal particles 35 are scattered therein and which is composed of a heat resistive elastomer, and a metal layer 30 composed of a solder layer is formed on a surface of the core 25. COPYRIGHT: (C)2007,JPO&INPIT
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