| 摘要 |
Laser-based material processing systems and methods for using such systems are disclosed herein. In one embodiment, for example, a laser-based material processing system includes a workpiece support, a positioning assembly over at least a portion of the workpiece support, and a laser. The system also includes a laser beam director carried by the positioning assembly to direct a beam generated by the laser toward the workpiece support. The system further includes a dispensing unit carried by the positioning assembly to discharge a material toward the workpiece support. The dispensing unit can be configured to discharge a number of different materials onto a workpiece carried by the workpiece support.
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