HOLLOW PACKAGE MADE OF RESIN, AND MANUFACTURING METHOD THEREFOR

摘要

Provided is a hollow package of made of a resin, which includes a moisture preventing island of a plate-shaped structure disposed below a semiconductor element mounting surface thereof and in which the semiconductor element mounting surface has an area of 200 mm² or more and has undulations of the maximum height of 35 µm or less. The hollow resin package is excellent in moisture resistance because it includes the moisture preventing island. Because of the excellent flatness of the semiconductor element mounting surface, the quantity of a peripheral light of a taken image hardly drops even with a wide-angle lens, if the hollow resin package is used in a digital single-lens reflex camera or the like using a large-sized solid image pickup element. According to the hollow resin package manufacturing method, an insertion molding is performed by fixing the moisture preventing island with a projection formed on the mold, so that the hollow resin package having the semiconductor element mounting surface of the undulations of the maximum height of 35 µm or less can be produced while preventing the dislocation of the moisture preventing island.