发明名称 |
A PLASMA ENHANCED ATOMIC LAYER DEPOSITION SYSTEM |
摘要 |
A plasma enhanced atomic layer deposition (PEALD) system includes a processing chamber defining an isolated processing space within the processing chamber, and a substrate holder provided within the processing chamber and configured to support a substrate. A first process material supply system is configured to supply a first process material to the processing chamber, a second process material supply system is configured to supply a second process material to the processing chamber and a power source is configured to couple electromagnetic power to the processing chamber. A contaminant shield is positioned along a periphery of the substrate holder and configured to impede external contaminants that permeate the chamber from traveling to a region of the substrate holder, wherein the film is formed on the substrate by altematingly introducing the first process material and the second process material.
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申请公布号 |
WO2006104864(A3) |
申请公布日期 |
2007.08.09 |
申请号 |
WO2006US10685 |
申请日期 |
2006.03.22 |
申请人 |
TOKYO ELECTRON LIMITED;ISHIZAKA, TADAHIRO;YAMAMOTO, KAORU |
发明人 |
ISHIZAKA, TADAHIRO;YAMAMOTO, KAORU |
分类号 |
C23C16/00 |
主分类号 |
C23C16/00 |
代理机构 |
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代理人 |
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地址 |
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