| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic equipment incorporating a semiconductor device in which a connection portion between a semiconductor element incorporating a contact sensor and a wiring board is protected. <P>SOLUTION: The electronic equipment incorporates a semiconductor device incorporating a contact sensor. The semiconductor device incorporating the contact sensor has a semiconductor element 1 incorporating the contact sensor having a sensor region 1b formed on a circuit formation surface, and a connection element 1c provided in a region out of the sensor region 1b; a wiring substrate 2 connected to the connection element 1c of the semiconductor element 1 such that an end face of the substrate 2 is situated on the circuit formation surface; and a protective resin section 7 provided so as to cover a portion from the end face of the substrate 2 to the circuit formation surface. The sensor region 1b is exposed from a housing 3 to the outside. <P>COPYRIGHT: (C)2007,JPO&INPIT |
