| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce local contact between a printed surface of a label sheet and a back surface of release paper due to steps in the label sheet surface and reduce color stains of printing ink on the label sheet surface, by solving the steps in the label sheet surface, in a roll of a label sheet that has a multilayer structure, in which release paper, adhesive, a backing of wood-free paper, IC tags, each comprising an IC chip and an antenna, adhesive, wood-free paper, and thermosensitive paper, are laminated in this order, and that has bumps in the surface due to the IC tag insertion. <P>SOLUTION: An adhesive label has a recess formed by embossing in the back surface of the release paper in a position directly below the bump appearing on the label sheet surface due to the placement of the IC chip in the IC tag built in the adhesive label, with an area at least corresponding to the IC chip and at a height corresponding at least to that of the IC chip. <P>COPYRIGHT: (C)2007,JPO&INPIT |
