| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To promote thinning and high-densification in an inter-substrate connector by eliminating mutual connection between three-dimensional complicated metal springs. <P>SOLUTION: The inter-substrate connector 1 has an umbrella-shaped bump 43 for electric conduction on a substrate 41, and has a connector 4 connected to a circuit board 2 that is conducted to this bump 43, and an elastic spring piece 54 having spring split pieces with different lengths of clamp ring state at a conductive pattern 53 on an insulation substrate 51, and is installed with a connector 5 connected to the circuit board 3 that is conducted to the elastic spring piece 54. A long, spring split piece 54a of the elastic spring piece 54 is elastically deformed toward opposite side to the inserted direction, when inserted into the bump 43, and pushes the umbrella part 43a of the bump 43, while a shorter one of spring split pieces 54b is inserted into a narrowed neck part 43b exceeding the umbrella part 43a, so that the umbrella part 43a is vertically pinched by both spring split pieces. By this, since the elastic spring piece 54 formed in a flat face state is inserted into the bump 43 and locked, the circuit boards are electrically and mechanically connected in between, and height reduction is realized. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
