| 摘要 |
PROBLEM TO BE SOLVED: To provide an anisotropic cooling element which enables space-saving and improvement of thermal conversion efficiency, and to provide a semiconductor element that is equipped with it. SOLUTION: The anisotropic cooling element 100 comprises an anisotropic thermally conductive member 110 attached to a heating element 10, the cooling/heat-radiating means 120<SB>1</SB>and 120<SB>2</SB>, which adsorb heat transmitted through the anisotropic thermally conductive member 110 to cool or radiate heat, and a contact layer which thermally forms the anisotropic thermally conductive member 110, in contact with each of the cooling/heat-radiating means 120<SB>1</SB>and 120<SB>2</SB>. The anisotropic thermally conductive member 110 is constituted by alternately laminating a plurality of thermally conductive layers, comprising a material having heat conductivity higher than that of the heating element 10 at least within a plane, and thermal resonator layers whose layer thickness is determined, according to the mean free path and the wavelength of the phonons that are to be the object. COPYRIGHT: (C)2007,JPO&INPIT
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