| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed wiring board enabling high density mounting. <P>SOLUTION: In a method for manufacturing a printed wiring board 403, a conductor pattern 401 coated with an electroplating film is formed on a surface of an insulating board 407. The method for manufacturing the printed wiring board has: a step for forming the conductor pattern 401 on the surface of the insulating board 407 and forming a plated lead electrically connected to the conductor pattern 401; a step for feeding a current through the plated lead to the conductor pattern 401 to coat the surface of the conductor pattern 401 with the electroplated film; and a step for irradiating the plated lead with a laser beam to fusion cut the plated lead. <P>COPYRIGHT: (C)2007,JPO&INPIT |
