| 摘要 |
PROBLEM TO BE SOLVED: To easily and inexpensively form a conductive circuit excellent in adhesiveness between a masking material and a substrate while each dielectric tangent of the masking material and the substrate is low to a high-frequency signal. SOLUTION: A primary substrate 1 is formed by injection-molding a cycloolefin-based resin composed by mixedly dispersing a soft polymer. A masking layer 2 is formed on the surface of the primary substrate by injection-molding a compatible cycloolefin-based resin into which the soft polymer is not mixed. The cycloolefin-based resin itself has an etching resistance. Hence, the surface of the primary substrate 1 not covered with the masking layer 2, that is, only a part 1a where the conductive circuit is formed is roughened while being hydrophilic by dissolving the soft polymer. Then a conductive layer 4 is selectively formed by nonelectrolytic plating only in the part 1a not covered with the masking layer 2. COPYRIGHT: (C)2007,JPO&INPIT
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