| 摘要 |
A support substrate or chuck 20 supports wafer dies during and after dicing of a semiconductor wafer and comprises an array of islands 21, upper faces of which are raised above a major face of the support substrate for alignment with an array of dies on, or singulated from, the wafer. The width of channels or recesses 22 between the islands is not less than a kerf of a laser, or a width of a blade, used to dice the wafer. For laser dicing, the upper faces of the islands are a sufficient height above the major face of the support substrate that the intensity of a laser beam 30 used to dice the wafer is reduced in the channels between the islands by defocusing before the beam reaches the major face so as to avoid machining of the support substrate by the beam. |
