发明名称 |
Solid-state imaging device and electronic endoscope using the same |
摘要 |
A solid-state imaging device comprises: a solid-state imaging element comprising a solid-state imaging element body; a first substrate one end face of which is bonded to and integrated with one end face of a solid-state imaging element substrate of the solid-state imaging element, the first substrate comprising on its one surface an electrode for establishing electrical contact with a bonding wire led from a pad provided on one surface of the solid-state imaging element, a frame that seals the solid-state imaging element so as to surround outer peripheral surfaces of the solid-state imaging element substrate excluding its the one end face; and a sealing resin portion that covers a region extending from a portion including the electrode on the one surface of the first substrate to a portion including the pad on the one surface of the solid-state imaging element. |
申请公布号 |
EP1816678(A2) |
申请公布日期 |
2007.08.08 |
申请号 |
EP20070002297 |
申请日期 |
2007.02.02 |
申请人 |
FUJIFILM CORPORATION;FUJINON CORPORATION |
发明人 |
SHIMAMURA, HITOSHI;TAKAHASHI, KAZUAKI;NISHIDA, KAZUHIRO |
分类号 |
A61B1/018;A61B1/05;G02B23/24;H01L27/146;H01L31/0203;H04N5/225 |
主分类号 |
A61B1/018 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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