| 摘要 |
PURPOSE: A semiconductor package is provided to increase the number of input and output terminals and the number of leads in semiconductor chips by laminating semiconductor chips of the same size or different sizes. CONSTITUTION: The first chip(10) is mounted in a semiconductor package(100). A bonding pad is arranged along an edge portion of the first chip(10). The first lead(14) and the second lead(16) are arranged around the edge of the first chip(10). The first lead(14) and the second lead(16) are arranged in a predetermined interval in order to increase the number of input and output terminals. A heat-sink(20) is adhered on an inner region of the bonding pad of the first chip(10) by an adhesive(24). The second chip(12) is adhered on an upper face of the heat-sink(12) by the adhesive(24). The bonding pad of the first chip(10) is connected with the first lead(14) by a wire(18). The first chip(10), the heat-sink(20), and the first and the second leads(14,16) are sealed by a resin(22). The second chip(12) is adhered on upper faces of the first and the second leads(16) by using a flip chip. |
