| 摘要 |
A side light emitting type LED package having a heat sink protrusion is provided to implement a high light intensity of the LED package by constraining the increase of thermal resistance and junction temperature of an LED chip. A side light emitting type LED package includes an LED chip(2), a package body(10), internal leads(22,32), first and second external leads(26,36), and a heat sink protrusion(24). The package body(10) has an aperture unit having an LED chip(2) on a side plane. The internal leads(22,32) are connected to the LED chip(2) directly or indirectly inside the aperture unit. The internal leads(22,32) are located in parallel with a side plane of the package body(10). The first and second external leads(26,36) are extended from each of the internal leads(22,32) to the outside of the package body(10) and are bent. The first and second external leads(22,32) form electric contact points of different polarities adjacent to a lower plane of the package body(10) which is perpendicular to the side plane of the package body(10). The heat sink protrusion(24) has the same plane with the internal leads(22,32) connected to the LED chip(2) directly. The heat sink protrusion(24) is protrusively extended from the internal leads(22,32) to the outside of the lower plane of the package body(10), and discharges heat of the LED chip(2). |
