Method for bonding gold- plated beam lead to semiconductor devices,申请号KR20010011999-传众专利搜索

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发明名称	Method for bonding gold- plated beam lead to semiconductor devices
摘要
申请公布号	KR100747392(B1)	申请公布日期	2007.08.08
申请号	KR20010011999	申请日期	2001.03.08
申请人		发明人
分类号	H01L21/60;H01L23/50	主分类号	H01L21/60
代理机构		代理人
主权项
地址

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