| 摘要 |
A display (300) comprises a display panel (310), and a package structure of chip on a flexible printed circuit board (chip on FPC). The package structure comprises a flexible printed circuit board (322), disposed on a side of the display panel (310), wherein the flexible printed circuit board (322) comprises a plurality of isolation layers (322a, 322b) and a conductive layer (322c) is disposed between the isolation layers (322a, 322b). The package structure also comprises a chip (324), comprising a plurality of contact points (324a), disposed on the flexible printed circuit board (322), wherein the contact points (324a) are electrically connected to the conductive layer (322c), and a protrusion (326), disposed on the flexible printed circuit board (322) between the chip and (324) the isolation layers (322a, 322b). Wherein the protrusion (326) prevents dust particles from entering a gap between the FPC (322) and the display panel (310), short circuiting is prevented and production yield increased. |
