发明名称 APPARATUS FOR TREATING SUBSTRATES
摘要 A substrate processing apparatus is provided to dry quickly a substrate, to protect the substrate from an external contamination source, to minimize the generation of water spot in a substrate drying process and to minimize the influence of external conditions. A substrate processing apparatus includes a substrate support member(110) with a chuck for loading a substrate, a lower chamber(120) for enclosing the ambient of the chuck, an upper chamber, an indirect spraying nozzle, and an absorbing member. The upper chamber(130) seals an upper opening portion of the lower chamber to perform a drying process on the substrate in a sealed space. The indirect spraying nozzle(140) is used for supplying a dry fluid into the sealed space. The absorbing member is used for guiding the flow of the dry fluid to a center portion of the substrate by absorbing compulsorily the dry fluid at an upper portion of the substrate center.
申请公布号 KR100749547(B1) 申请公布日期 2007.08.08
申请号 KR20060072618 申请日期 2006.08.01
申请人 SEMES CO., LTD. 发明人 PARK, KEUN YOUNG;KIM, JU WON
分类号 H01L21/304 主分类号 H01L21/304
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