MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD

摘要

A method for manufacturing a printed circuit board is provided to reduce the manufacturing cost and process by using only an electric copper plating process. In a method for manufacturing a printed circuit board, a circular plate including an insulation layer(111) and a first copper foil and a second copper foil on both planes of the insulation layer is prepared. A blind via hole is formed for electrical conduction of the circular plate. A plated resist(115) is deposited on the bottom of the second copper foil located on the bottom of the insulation layer. A copper plated layer(116) is formed in the blind via hole by applying a current to the second copper foil.