发明名称 MOLD RELEASE FILM
摘要 <p>It is an object of the present invention to provide a release film which is superior in the flexibility at high temperature, the conformability to circuit patterns, the heat resistance, the releasing property and the non-contaminative property, and easily discarded after use. The present invention relates to a release film, which is used in a manufacturing process of a printed-circuit board, a flexible printed-circuit board or a multilayer printed-circuit board, having a layer comprising a resin composition comprising a resin having a polar group in a main chain as a matrix and having a halogen content of 5% by weight or less on at least one surface.</p>
申请公布号 EP1698655(A4) 申请公布日期 2007.08.08
申请号 EP20030786350 申请日期 2003.12.26
申请人 SEKISUI CHEMICAL CO., LTD. 发明人 MATSUMOTO, HIROTAKE;SHIRATO, HITOSHI;INOUE, HIDEKAZU
分类号 C08J5/18;B32B27/36;C08L67/02;H05K1/00;H05K3/00;H05K3/02;H05K3/46 主分类号 C08J5/18
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