发明名称 |
Process for producing circuit board having built-in electronic part |
摘要 |
<p>The present invention provides a process for producing a circuit board (7) having built-in electronic parts (1), which comprises the steps of: disposing two wiring circuit boards (2) each having an electronic part (1) mounted thereon so that the electronic-part-mounting sides of the respective circuit boards (2) face each other; disposing a resin layer (3) between the circuit boards (2); and press-bonding the resin layer (3) to the circuit boards (2).
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申请公布号 |
EP1555862(A3) |
申请公布日期 |
2007.08.08 |
申请号 |
EP20050001025 |
申请日期 |
2005.01.19 |
申请人 |
NITTO DENKO CORPORATION |
发明人 |
UWADA, KAZUKI;HOTTA, YUJI |
分类号 |
C08G18/34;H05K1/18;C08G18/69;H01L21/48;H01L23/498;H01L23/538;H05K3/28;H05K3/30;H05K3/46 |
主分类号 |
C08G18/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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