发明名称 Process for producing circuit board having built-in electronic part
摘要 <p>The present invention provides a process for producing a circuit board (7) having built-in electronic parts (1), which comprises the steps of: disposing two wiring circuit boards (2) each having an electronic part (1) mounted thereon so that the electronic-part-mounting sides of the respective circuit boards (2) face each other; disposing a resin layer (3) between the circuit boards (2); and press-bonding the resin layer (3) to the circuit boards (2). </p>
申请公布号 EP1555862(A3) 申请公布日期 2007.08.08
申请号 EP20050001025 申请日期 2005.01.19
申请人 NITTO DENKO CORPORATION 发明人 UWADA, KAZUKI;HOTTA, YUJI
分类号 C08G18/34;H05K1/18;C08G18/69;H01L21/48;H01L23/498;H01L23/538;H05K3/28;H05K3/30;H05K3/46 主分类号 C08G18/34
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