| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an apparatus for mapping a wafer where an equipment for spreading/storing a passing-through type sensor is not necessarily located close to a wafer, and dust which is produced from the apparatus due to spreading/storing the passing-through type sensor in a spreading/storing operation can be prevented from contaminating the wafer. SOLUTION: In the apparatus for mapping a wafer, mapping frame 5, to which the passing-through type sensor 9 is fixed, is located apart from an opening 10 when the opening 10 is closed with a door 6. After the cover 4 is separated by the door 6 holding the cover 4, a cylinder 35 for driving the mapping frame operates, thereby, the mapping frame 5 is rotated around a fulcrum 41, the passing-through type sensor 9 is inserted into a pod 2, and the passing- through type sensor 9 runs across the semiconductor wafer 1 by removal of a moving portion 56.</p> |
