| 摘要 |
PROBLEM TO BE SOLVED: To prevent the bump damage of a semiconductor wafer or the partial elongation of a die bond tape, make the adhesion thickness of the die bond tape constant, avoid re-adhering of the tape after tape cutting and prevent the wafer from being broken in an extra tape peeling step. SOLUTION: A die bond tape 3 is positioned directly above a heated semiconductor wafer 1 supported with a wafer mounting table 21, the pressing force exerted on the wafer 1 with a sticking roll 26 is adjustable and changed at some regions to make uniform the line pressure of the roll 26 for pressure bonding, thereby sticking the tape 3 with a fused adhesive, and an extra portion of the tape 3 is cut through by a cutter 34 and peeled off from the table 21. |
