| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board which is capable of dealing with minute interconnections, whose mass productivity is superior and of dealing with also a multilayered interconnection, and to provide a manufacturing method for the wiring board. SOLUTION: A multilayered interconnection board 100 is constituted in such a way that an insulating layer is formed on the whole face of at least one face of a base board 110, and the plurality of metal wiring layers which are plated and formed are transferred sequentially so as to be formed on the insulating layer 120. Then, all metal interconnections in the metal wiring layer as an entire first layer are formed directly on the insulating layer 120, in such a way that one face of them is lined up with the face on the upper side of the insulating layer 120 and that the entire body is embedded in the insulating layer. In addition, all the metal interconnections in the metal wiring layers after a second layer and subsequent layers are laminated on the insulating layer or the interconnections via an insulating resin layer or a conductive resin layer under wiring parts of the metal interconnections. |
