| 摘要 |
A chamber is provided to improve the performance of a wafer heater and to restrain the increase of costs due to the replacement of the wafer heater by preventing a material layer from being deposited on an outer heater of the wafer heater using an improved connection structure between the outer heater and a guide ring. A chamber includes a wafer heater and a guide ring. The wafer heater(100) heats a wafer and is composed of an inner heater(120) and an outer heater(140). The guide ring(200a) encloses the outer heater. A free-gap structure is formed between the outer heater and the guide ring, so that a material layer is prevented from being deposited on the outer heater. The material layer is made of WSix.
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