发明名称 Method and apparatus for monitoring for failure temperatures of a structure
摘要 An apparatus for monitoring a temperature of a structure, comprising: one or more electrically conductive loops adapted to be affixed to the structure, each including first and second elongate connection strips each made of a first metal composition having a first melting point, and a temperature sensitive band connected between the first and second connection strips and made of a second metal composition having a second melting point less than the first melting point. The apparatus further comprises a monitor, connected to respective ends of the first and second connection strips spaced-apart from the temperature sensitive band, configured to detect an open-circuit in the one or more electrically conductive loops caused when the temperature sensitive band separates from either of the connection strips.
申请公布号 US7253740(B2) 申请公布日期 2007.08.07
申请号 US20050070454 申请日期 2005.03.02
申请人 THE JOHNS HOPKINS UNIVERSITY 发明人 CAIN RUSSELL P.;CARKHUFF BLISS G.;LENNON ANDREW M.
分类号 G08B7/06 主分类号 G08B7/06
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