LEAD FRAME , LIGHT EMITTING DEVICE PACKAGE USING THE SAME AND FABRICATING METHOD THEREOF

摘要

A lead frame, a light emitting device package using the same, and a fabricating method thereof are provided to enhance reliability by preventing inflow of a molding resin into a bonding area of a light emitting element. A light emitting element is loaded into a first frame(100). The first frame is connected to a heat-sink(110). Grooves(111,112) are formed at both sides of an upper surface of the heat-sink. A second frame(200) is installed at an upper part of the first frame. The second frame is connected to a first and second leads(211,212) which do not come in contact with the heat-sink by the grooves of the heat-sink. A structure(230) having a through-hole(231) is connected to the second frame. The light emitting element is positioned in the inside of the structure. The structure is loaded on the upper surface of the heat-sink.