发明名称 High density memory module using stacked printed circuit boards
摘要 A module is electrically connectable to a computer system. The module includes a frame having an edge connector with a plurality of electrical contacts which are electrically connectable to the computer system. The module further includes a first printed circuit board coupled to the frame. The first printed circuit board has a first surface and a first plurality of components mounted on the first surface. The first plurality of components is electrically coupled to the electrical contacts of the edge connector. The module further includes a second printed circuit board coupled to the frame. The second printed circuit board has a second surface and a second plurality of components mounted on the second surface. The second plurality of components is electrically coupled to the electrical contacts of the edge connector. The second surface of the second printed circuit board faces the first surface of the first printed circuit board. The module further includes at least one thermally conductive layer positioned between the first plurality of components and the second plurality of components. The at least one thermally conductive layer is thermally coupled to the first plurality of components, to the second plurality of components, and to the electrical contacts of the edge connector.
申请公布号 US7254036(B2) 申请公布日期 2007.08.07
申请号 US20050101155 申请日期 2005.04.07
申请人 NETLIST, INC. 发明人 PAULEY ROBERT S.;BHAKTA JAYESH R.;GERVASI WILLIAM M.;CHEN CHI SHE;DELVALLE JOSE
分类号 H05K7/20 主分类号 H05K7/20
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