发明名称 |
Semiconductor package featuring metal lid member |
摘要 |
In a semiconductor package, a semiconductor chip is mounted on a wiring board or package board. A lid member defines a recess for accommodating the semiconductor chip, and is mounted on the package board so that the semiconductor chip is accommodated in the recess of the lid member. A first adhesive layer is formed on the package board so that a peripheral portion of the lid member is adhered on the package board with the first adhesive layer. A second adhesive layer is formed on the semiconductor chip so that a central portion of the lid member is adhered to the semiconductor chip with the second adhesive layer. The following relationship is established: <?in-line-formulae description="In-line Formulae" end="lead"?>25 mum<=h-d<=300 muM<?in-line-formulae description="In-line Formulae" end="tail"?> where: "d" is a depth of the recess of the lid member; and "h" is a sum of a thickness of the semiconductor chip and a thickness of the second adhesive layer. |
申请公布号 |
US7253515(B2) |
申请公布日期 |
2007.08.07 |
申请号 |
US20060495737 |
申请日期 |
2006.07.31 |
申请人 |
NEC ELECTRONICS CORPORATION |
发明人 |
HORIE MASANAO;KARIYAZAKI SHUUICHI |
分类号 |
H01L23/12 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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