PACKAGE ON PACKAGE SUBSTRATE AND THE MANUFACTURING METHOD THEREOF

摘要

A POP(Package On Package) substrate and its manufacturing method are provided to increase the number of integrated chips without the increase of thickness by extending the distance between a top package and a bottom package using a metal bump and cavity of the bottom package. An inner circuit(12) is formed on a surface of a core substrate(10). A metal plate with a circuit pattern corresponding to an outer circuit(52) is formed on the surface of the core substrate via an insulating member(40). At this time, the circuit pattern is opposite to the inner circuit. A portion of the insulating member for forming the outer circuit is exposed to the outside by removing selectively the metal plate except a metal bump forming portion. A cavity(30) is formed on the resultant structure and the inner circuit is selectively exposed to the outside by removing partially the insulating member.