发明名称 |
Semiconductor device and manufacturing method thereof |
摘要 |
A pin diode is formed by a p<SUP>+</SUP> collector region, an n type buffer region, an n<SUP>-</SUP> region and an n<SUP>+</SUP> cathode region. A trench is formed from the surface of n<SUP>+</SUP> cathode region through n<SUP>+</SUP> cathode region to reach n<SUP>-</SUP> region. An insulating film is formed along an inner wall surface of trench. A gate electrode layer is formed to oppose to the sidewall of n<SUP>+</SUP> cathode region with insulating film interposed. A cathode electrode is formed to be electrically connected to n<SUP>+</SUP> cathode region. An anode electrode is formed to be electrically connected to p<SUP>+</SUP> collector region. The n<SUP>+</SUP> cathode region is formed entirely over the surface between trenches extending parallel to each other. Thus, a power semiconductor device in which gate control circuit is simplified and which has good on property can be obtained.
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申请公布号 |
US7253031(B2) |
申请公布日期 |
2007.08.07 |
申请号 |
US20040978440 |
申请日期 |
2004.11.02 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
TAKAHASHI TETSUO;NAKAMURA KATSUMI;MINATO TADAHARU;HARADA MASANA |
分类号 |
H01L21/332;H01L21/331;H01L21/336;H01L29/06;H01L29/423;H01L29/739;H01L29/74;H01L29/76;H01L29/768;H01L29/861;H01L29/868;H01L31/111 |
主分类号 |
H01L21/332 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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