| 摘要 |
An integrated circuit chip is provided. The chip includes a silicon substrate, a circuit, a seal ring, a ground ring and a guard ring. The circuit is formed on the silicon substrate and has an input/output (I/O) pad. The seal ring is formed on the silicon substrate and surrounds the circuit and the I/O pad. The ground ring is formed between the silicon substrate and the I/O pad, and the ground ring is electrically connected with the seal ring. The guard ring is formed above the silicon substrate and surrounds the I/O pad, and the guard ring is electrically connected with the seal ring.
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