发明名称 |
Ball grid array package construction with raised solder ball pads |
摘要 |
The present invention provides for a BGA solder ball interconnection to an outer conductive layer of a laminated circuit assembly having an underlying circuit layer. The invention includes a raised BGA solder ball pad substantially co-planar with the outer conductive layer, the raised pad having a raised face and a plurality of vertical conductive walls and a BGA solder ball having an average diameter of greater than the width of the raised face, the BGA solder ball being adhered to the raised face and to a substantial portion of the vertical conductive walls.
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申请公布号 |
US7253510(B2) |
申请公布日期 |
2007.08.07 |
申请号 |
US20030346277 |
申请日期 |
2003.01.16 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
HARVEY PAUL MARLAN |
分类号 |
H01L23/12;H01L29/40;H01L21/00;H01L21/44;H01L23/02;H01L23/498;H01L25/065;H01L25/07;H01L25/18;H05K1/00;H05K1/11;H05K1/14;H05K1/18;H05K3/34;H05K3/46;H05K7/00;H05K7/20 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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