发明名称 APPARATUS FOR SUBSTRATE WET TREATING HAVING HEATING PART IN CHEMICAL BATH AND METHOD OF HEATING CHEMICAL FOR SUBSTRATE TREATING USING THE APPARATUS
摘要 A substrate wet treating apparatus having a heating unit in a chemical bath and a method for heating a chemical for treating a substrate by using the same are provided to prevent contamination of the chemical due to corrosion of a heating member by preventing the contact between the chemical and the heating member. A chemical bath is used for storing a chemical for treating a substrate. A heating unit is installed in the inside of the chemical bath and includes a heating member(155), a housing(150) for storing the heating member, and an inert gas for filling up the housing. A gas pressure sensor(165) is installed in the inside of the housing to sense the pressure of the inert gas in the housing. The gas pressure sensor generates alarm sound when the sensed pressure is lower than the reference pressure. A control panel(170) is connected to the gas pressure sensor. The control panel stops an operation of the heating member when the sensed pressure is lower than the reference pressure.
申请公布号 KR20070079242(A) 申请公布日期 2007.08.06
申请号 KR20060009808 申请日期 2006.02.01
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE, BYEONG CHU;HEO, DONG CHUL;CHO, MO HYUN
分类号 H01L21/306;H01L21/304 主分类号 H01L21/306
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