COATING METHOD OF PACKAGE FOR LIGHT EMITTING DIODE
摘要
A reflective coating method for an LED package is provided to improve the reflectivity of an inner surface of a through hole in a reflective layer by coating a metal paste along the inner surface of the through hole using a squeeze under a vacuum condition. A frame is arranged on an upper surface of a reflective layer with a plurality of through holes(S10). At this time, a net portion of the frame is arranged corresponding to the through hole of the reflective layer. A metal paste is arranged on the upper surface of the frame(S20). The metal paste is coated on an inner surface of the through hole by making the metal paste pressed down using a squeeze(S30). At this time, a lower portion of the reflective layer is in a vacuum state.
申请公布号
KR100748597(B1)
申请公布日期
2007.08.06
申请号
KR20070021240
申请日期
2007.03.05
申请人
IMTECH INC.;KIM, MIN SOO;KIM, KI WOUNG
发明人
KIM, MIN SOO;KIM, KI WOUNG;LEE, JONG KIL;RHIM, SUNG HAN;HONG, JOO PYO