| 摘要 |
<p>A printed circuit board assembly and a manufacturing method thereof are provided to reduce a manufacturing cost of the PCB by mechanically or electrically coupling plural layers using a high pressure and a high temperature. A printed circuit board assembly(1) includes PCBs(12a,12b) and a connection layer(13a). Each of the PCBs has plural layers including an insulation layer(14) and a wiring layer(15). Signal lines are connected to the wiring layer through a via-hole(16). An electrode terminal(17) connected to a signal line, a power line, or a ground layer, is formed on a surface which is connected to a connection layer of the PCB. A UV(Ultra-Violet) type epoxy resin is applied on the surface of the PCB(Printed Circuit Board).</p> |
