| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wafer level package structure for realizing simplification of manufacturing processes, a decrease in temperature of processes, and improvement of yield of a joining process; and to provide a sensor element. <P>SOLUTION: The wafer level package structure 100 has a configuration in which bonding metal layers 18, 28 for sealing for the sensor wafer 10 and the first package wafer 20 and bonding metal layers 16, 23 for connection are directly joined. The metal layers 18, 28 and 19, 29 are each configured of a laminated film of a Ti film and an Au film on insulating films 16, 23. The sensor element is formed by dividing the wafer level package structure 100 into a desired predetermined size on the basis of the size of a sensor substrate (sensor body) 1 in the sensor wafer 10. <P>COPYRIGHT: (C)2007,JPO&INPIT |
