| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor package by which peeling on the interface between a first semiconductor chip and a die bonding agent can be suppressed. <P>SOLUTION: A first silicon wafer substrate 1 wherein first semiconductor chips 2 are formed is adhered to a dicing tape 4 containing no plasticizer, and it is diced into the first semiconductor chips. Then, a second semiconductor chip 6 is arranged on the first semiconductor chip 2, and they are heated to melt a bump 3 on the first chip and a bump 7 of the second chip together, thereby electrically connecting the first and second chips with each other and mounting it to a mounting substrate. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
