| 摘要 |
PROBLEM TO BE SOLVED: To avoid occurrence of a short circuit due to an increase in amount of cream solder 13a to be transferred to a connection portion. SOLUTION: A method of manufacturing a module includes: a printing process 52 for printing cream solder 61 on a printed board 22; a reflow process 4 for soldering the cream solder 61 after the printing process 52; a cover mounting process 56 for applying a flux onto a connection portion between the cover 27 and a land 26 after the reflow process 4, and mounting the cover 27 at a position where a bent portion 28 of the cover 27 is confronted with the land 26; and a remelting process 57 for remelting solder applied to the land 26 after the cover mounting process 56. With this method, a short circuit between the connection portion and an electronic component due to the solder at the connection portion can be prevented. COPYRIGHT: (C)2007,JPO&INPIT
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