| 摘要 |
An apparatus, system, and method are disclosed for thermal conduction interfacing. The apparatus for thermal conduction interfacing is provided with a first layer formed substantially of a pliable thermally conductive material. The apparatus includes a second layer formed substantially of a pliable thermally conductive material and coupled at the edges to the first layer forming a pliable packet, wherein the first layer and the second layer conform to a set of thermal interface surfaces. Additionally, the apparatus includes a plurality of thermally conductive particles disposed within the packet, wherein thermal energy is transferred from the first layer to the second layer through the thermally conductive particles. Beneficially, such an apparatus, system, and method would provide effective thermal coupling between a heat generating device and a heat dissipating device. Additionally, the apparatus, system, and method would be modular, reusable, and easy to install or replace without a significant mess.
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