发明名称 Sensor module has control circuit arranged as integrated circuit on substrate, and sensor module has two sensor elements, and one of sensor elements is micro-electromechanical sensor made of silicon wafer
摘要 The module has a control circuit arranged as integrated circuit on a substrate, and the sensor module has two sensor elements. One of the sensor elements is a micro-electromechanical sensor made of a silicon wafer. The sensor module is designed as surface-mountable construction unit as plated through construction unit.
申请公布号 DE202007006274(U1) 申请公布日期 2007.08.02
申请号 DE20072006274U 申请日期 2007.05.02
申请人 FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V. 发明人
分类号 G01D21/00;B81B7/02 主分类号 G01D21/00
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