发明名称 |
Sensor module has control circuit arranged as integrated circuit on substrate, and sensor module has two sensor elements, and one of sensor elements is micro-electromechanical sensor made of silicon wafer |
摘要 |
The module has a control circuit arranged as integrated circuit on a substrate, and the sensor module has two sensor elements. One of the sensor elements is a micro-electromechanical sensor made of a silicon wafer. The sensor module is designed as surface-mountable construction unit as plated through construction unit. |
申请公布号 |
DE202007006274(U1) |
申请公布日期 |
2007.08.02 |
申请号 |
DE20072006274U |
申请日期 |
2007.05.02 |
申请人 |
FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V. |
发明人 |
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分类号 |
G01D21/00;B81B7/02 |
主分类号 |
G01D21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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