POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND CURED FILM OBTAINED THEREFROM

摘要

[PROBLEMS] To provide: a positive photosensitive resin composition which has excellent storage stability and high sensitivity and is reduced in film thickness loss in unexposed areas and which, even when subjected after film formation to burning at a high temperature or a treatment with a resist stripper liquid, retains a high transmittance and suffers no decrease in film thickness; and a cured film which is obtained from the positive photosensitive resin composition and is suitable for use as a film material for various displays, e.g., an array planarization film for TFT liquid-crystal elements. [MEANS FOR SOLVING PROBLEMS] The positive photosensitive resin composition comprises: ingredient (A) which is a thermally crosslinked polymer formed from a base polymer having a functional group capable of undergoing heat curing reaction by bonding the base polymer to itself through a chemical structure comprising two or more heat-crosslinkable groups represented by the formula (1); [Chemical formula 1] formula (1) ingredient (B) which is a compound having two or more blocked isocyanate groups per molecule; ingredient (C) which is a photo-acid generator; and a solvent (D).