MICRO ELEMENT PACKAGE AND MANUFACTURING METHOD THEREOF

摘要

A micro element package and a method for manufacturing the same are provided to reduce the size of the package and to improve the productivity by simplifying remarkably a micro element package manufacturing process. A substrate(100) having a micro element(110) and a light transmitting cover(200) having a groove are provided. The light transmitting cover is bonded to the substrate. At this time, the groove of the light transmitting cover faces the micro element of the substrate and the light transmitting cover is spaced apart from the micro element. The groove is exposed to the outside by removing selectively the light transmitting cover from the resultant structure. A dicing process is performed on the substrate along the exposed groove.