SIDE VIEW TYPE LED PACKAGE

摘要

A side view type LED package is provided to make a high current used and to improve the luminous intensity of the package by preventing the increase of a junction temperature of an LED chip and reducing remarkably a thermal resistance using an increased heat radiating path. A side view type LED package includes an LED chip, a package body, and a lead frame. The package body(10) includes an opening portion(12) for mounting the LED chip at a lateral portion. The lead frame(20) is electrically connected with the LED chip in the opening portion of the package body. The lead frame is composed of lower legs and upper legs. The lower legs are prolonged to a lower portion of the package body. At least a portion of the lower leg forms an electric contact point. The upper legs(24a,24b) are extended to an upper portion of the package body to form a heat radiating path.