发明名称 SUBSTRATE PROCESSING APPARATUS AND METHOD
摘要 A substrate processing apparatus and a substrate processing method are provided to protect effectively a corresponding window member from ultraviolet reactants by heating the window member for irradiating ultraviolet rays at predetermined temperature in a scanning manner. A placing plate is used for supporting a target substrate. An ultraviolet irradiation unit includes a lamp for radiating ultraviolet rays and a window member for transmitting the ultraviolet rays to irradiate the ultraviolet rays of the lamp through the window member onto the target substrate of the placing plate. A driving unit moves one side or both sides of the placing plate and the ultraviolet irradiation unit to a predetermined direction to cause a relative movement between the placing plate and the ultraviolet irradiation unit. A heating unit is installed on the placing plate to heat the window member at the predetermined temperature when the placing plate and the ultraviolet irradiation unit are relatively moved from each other.
申请公布号 KR20070078825(A) 申请公布日期 2007.08.02
申请号 KR20070061562 申请日期 2007.06.22
申请人 TOKYO ELECTRON LIMITED 发明人 OTA YOSHIHARU
分类号 H01L21/30;H01L21/00 主分类号 H01L21/30
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