| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a surface acoustic wave element which is easily made small-sized and thin and is easy to package and has a high reliability. <P>SOLUTION: The method of a surface acoustic wave element 10 having comb-shaped IDT electrodes 60 formed on a surface of a semiconductor substrate 20, includes steps of; forming insulating layers 21 to 23 on an active side surface of the semiconductor substrate 20; forming a base layer 30 throughout a surface of the insulating layer 23; flattening a surface of the base layer 30; forming a piezoelectric material 51 on the flattened surface of the base layer 30; forming IDT electrodes 60 on a surface of the piezoelectric material 51; and forming a bank 41 which is higher than a height from the surface of the base layer 30 to surfaces of IDT electrodes 60 and surrounds the piezoelectric material 51 and the IDT electrodes 60, on a surface peripheral edge part of the base layer 30. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
