| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a highly reliable optical semiconductor device obtained by fixing a light emitting element by using die bonding resin paste which has high heat conductivity, is superior in adhesive property, and has high heat resistance. <P>SOLUTION: In the optical semiconductor device, a light emitting element chip is fixed on an upper face of a substrate where an electrode is formed through an adhesive layer, and the light emitting chip is sealed. Adhesion strength with a frame is 1 kgf/mm<SP>2</SP>or above after the adhesive layer is processed with a condition of 85°C×85%RH×72 hours and is reflow-processed at 260°C. Thermal conductivity is 20 W/mK or above and electrical resistivity is 7×10<SP>-6</SP>Ω cm or below. <P>COPYRIGHT: (C)2007,JPO&INPIT |
