| 摘要 |
PROBLEM TO BE SOLVED: To manufacture a delivery element chip for a low-cost and precise liquid delivery head. SOLUTION: An electrothermal converting element 2 and a flow passage forming member 6 or the like are formed on a substrate material 11 comprising a silicon substrate, and the rear surface side of the substrate material 11 is thinned by wet etching to form a thin substrate 1. Then, a mask is formed on the rear surface of the substrate 1, and anisotropic etching is applied to the substrate 11 from the pattern opening of the mask to remove the silicon of the portion as a supply port and to remove the flow passage pattern R in the flow passage forming member 6, thereby a flow passage is formed. The wet etching is used for thinning the substrate material 11 to prevent contamination and deformation of the substrate surface. COPYRIGHT: (C)2007,JPO&INPIT
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