发明名称 LED MOUNTING STRUCTURE AND MANUFACTURING METHOD THEREFOR
摘要 <P>PROBLEM TO BE SOLVED: To provide an LED mounting structure and a manufacturing method therefor which improve optical power efficiency and reduce energy loss. <P>SOLUTION: The LED mounting structure includes a mounting body 202, a lead frame 210, and a reflection wall 214. The mounting body 202 has an inside chip placement area 204 in which an LED chip 230 is placed, and a part of the lead frame 210 is exposed to the chip placement area 204. The reflection wall 214 is connected to the lead frame 210, and is bent from the lead frame 210 to extend to cover the chip placement area 204 as a side wall in guiding emission light from the LED chip 230. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007194579(A) 申请公布日期 2007.08.02
申请号 JP20060199868 申请日期 2006.07.21
申请人 EVERLIGHT ELECTRONICS CO LTD 发明人 YEH YIN-FU;CHUANG SHIH-JEN
分类号 H01L33/56;H01L33/60;H01L33/62;H01L33/64 主分类号 H01L33/56
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